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irda technical information 1 gp2w0110yps/GP2W0114YPS irda technical information low power infrared transceiver features ? irda low power option co mpatibility fo r telecom- munication and mobile terminals industry low volume package design for a low power transceiver: ? 7.6(w) 2.65(d) 2.0(h) mm, 40.28 mm 3 low power consumption with built-in shut-down mode 0.2 a (typ.) low and wide range operating voltage: ?v dd = 2.0 v to 3.6 v, v leda = 2.0 v to 6.0 v soldering reflow capable smd lead-less package design provides flexibility with either vertical mount or horizontal mount to pcbs replaces gp2w0102yp, gp2w0104yp, and gp2w0106yp added features include tri-state output and split- voltage supply capability fully compatible wi th agilent hsdl 3201 top view version: GP2W0114YPS applications telecommunication products ? cellular phones ? pagers ? smart phones mobile products ?pdas ? electronic wallets ? mini-notebook pcs imaging products ? portable printers ? portable text scanners description the sharp gp2w0110yp s/GP2W0114YPS are low-power, short-range infrared transceiver modules. they meet the mobile communication low power option within the irda specification for the 20 cm com- munication range. when operating at lower supply volt- ages, these units provide a reliable interface between logic and ir signals. applications include through-air, serial, half-duplex ir wireless data links at rates up to 115 kbit/s and the devices are designed to satisfy the irda physical layer specifications. the sharp gp2w0110yps/GP2W0114YPS infrared transceiver modules contain a high speed, high efficiency, low power consumption algaas led, silicon pin photodiode, and the low power driven bipo- lar integrated circuit. the ic contains a led driver cir- cuit and a receiver that provides the rx output supporting 2.4 kbit/s to 115.2 kbit/s irda signals. they meet the irda low power option communication standard link distance of 0.2 m with low power devices and 0.3 m with standard devices. the gp2w0110yps/GP2W0114YPS include a con- stant-current source in the led driver circuit that elimi- nates the need for an external current limiting resistor in the led circuit. the irda low power option standard is most suit- able for telecommunication products and mobile termi- nals, such as cellular phones, paging devices, and pda-cellular combined multimedia devices. the trans- ceiver modules provide wirele ss data link capability for cellular phones and pagers, pdas, or any other irda application already on the market. the transceiver modules? receiver electronics oper- ate at voltages from 2.0 v through 3.6 v without any performance degradation. the split-voltage supply allows the led voltage to come from a separate supply. an example is in cell phones where the led may oper- ate from the battery and the receiver and logic section is supplied from a regulated supply at a lower voltage. this provides manufacturers with the advantage of an energy saving design in any app lication field, with alter- natives for supply voltage and flexibility for other compo- nents. the gp2w0110yps/GP2W0114YPS transceiver modules have a built-in 0.1 a shutdown mode for those applications that are very conscious about current consumption. additionally, the gp2w0110yps/GP2W0114YPS have a tri-state out- put, which allow their use in applications where one port connection may be connected to more than one device. the included shield is appropriate in applications where electro-magnetic interference (emi) is a con- cern. infrared energy is immune to emi, but the receiv- ing pin photodiode is some what sensitive to emi. this is the case in all ir communication devices.
gp2w0110yps/GP2W0114YPS low po wer infrared transceiver 2 irda technical information outline dimensions the dimensions below are only for design reference, and are subject to change without notice. the metal shield case provides excellent noise immunity. contact your local sharp office for the latest device specifica- tions. figure 1. gp2w0110yps/GP2W0114YPS outline dimensions center of detector center of emitter carved seal 1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8 nc nc v cc ground shutdown receiver data output transmitter data input notes: 1. dimensions are in mm. 2. unspecified tolerances are 0.2 3. adhesion of resin to the terminal area are allowed 0.2 mm max. 4. area: gold plating led anode nc pin pin name symbol nc v cc gnd sd rxd txd leda 2.2 2.0 5.7 2.5 5.2 po. 95 7 = 6.65 po. 95 7 = 6.65 7.9 0.3 2.0 0.3 0.8 +0.3 - 0.2 8 - 0.4 8 - 0.6 +0.2 - 0.3 1.05 0.3 0.6 0.3 1.5 0.3 2.15 0.3 2.75 0.3 2.85 0.3 0.35 gp2w0110yps-15
low power infrared transc eiver gp2w0110yps/GP2W0114YPS irda technical information 3 absolute maximum ratings note: *see figure 12 for soldering reflow profile. recommended operat ing conditions notes 1. shutdown mode 2. normal mode 3. led on 4. led off 5. bit rate = 2.4 kbit/s ~ 115 kbit/s (in-band signals) 6. an in-band optical signal is a pulse /sequence where the peak wavelength, p , is defined as 850 nm p 900 nm, and the pulse char acteristics are compliant with the irda serial infrared ph ysical layer link specifications. 7. 25c (typ.) parameter symbol min. max. unit supply voltage v dd 06.0v led supply voltage v leda 07.0v peak forward led current i fm 60 ma operating temperature t opr -40 +85 c storage temperature t stg -40 +85 c soldering temperature* t sol 230 c parameter symbol min. max. unit notes supply voltage v dd 2.0 3.6 v led supply voltage v leda 2.0 6.0 v logic high shut-down terminal input voltage v ihsd v dd 0.67 v dd v1 logic low shut-down terminal input voltage v ilsd 0.0 v dd 0.1 v 2 logic high transmitter input voltage (txd) v ihtxd v dd 0.75 v dd v3 logic low transmitter input voltage (txd) v iltxd 0.0 v dd 0.2 v 4 logic high receiver input irradiance e ih 9.0 w/cm 2 5, 6 receiver signal rate br 2.4 115.2 kbit/s operating temperature t opr -25 +85 c 7
gp2w0110yps/GP2W0114YPS low po wer infrared transceiver 4 irda technical information electrical and opti cal specifications notes: 1. these specifications reflec t the recommended operating condi- tions, unless otherwise noted. 2. all typical values are at 25c and v dd = 2.0 v to 3.6 v, unless oth- erwise noted. 3. see figure 3. parameter symbol min. typ. m ax. unit conditions notes maximum reception distance l > 0.2 m 2 1/2 < 15 , i e = 3.6 mw/sr 1, 2 high level output voltage v ohrxd v dd ? 0.4 v i oh = 20 a 1, 2 low level output voltage v olrxd 0.45 v i ol = 20 a 1, 2 viewing angle 2 30 degrees 1, 2 low level pulse width t w 1.0 3.0 s br = 115.2 kbit/s, 2 1/2 15 1, 2 current consumption i dd 90 120 a no input signal, sd = 0 v, output terminal open 1, 2 i dds 0.01 2.0 a shutdown mode, no input signal, v ihsd = v dd ? 0.5 v, output terminal open, t opr = 25 c, v dd = 3.3 v. 1, 2 rise time t r 0.19 s 1, 2, 3 fall time t f 0.19 s 1, 2, 3 latency t tat 25 300 s 1, 2 receiver wakeup time t sdw 200 s 1, 2 radiant intensity i e 3.6 25 mw/sr 2 1/2 < 15 , br = 115.2 kbit/s, v leda = 3.3 v, v ihtxd = 2.8 v, 1, 2 peak emission wavelength p 850 870 900 nm peak led current i led 32 ma shutdown input current i isd -0.02 0 +0.02 a t opr = 25 c, v dd = 3.3 v. 1, 2 txd high level input current i ihtxd 50 a txd low level input current i iltxd 0.2 a figure 2. gp2w0110yps/GP2W0114YPS infrared transceiver module output waveform v ol v oh 90% v oh 50% 10% criteria for pulse position v ol t f t r t w gp2w0110yps-2 figure 3. standard optical system t r t f i e gp2w0110yps-16
low power infrared transc eiver gp2w0110yps/GP2W0114YPS irda technical information 5 table 1. truth table sd txd led receiver tr1 tr2 rxd low high on don?t care not valid low off irda signal off on low no signal on off high high don?t care off don?t care off off pull-up table 2. pinouts pin no. description symbol 1 no connection nc 2 no connection nc 3 supply voltage v dd 4 ground gnd 5 shutdown sd 6 receiver data output rxd 7 transmitter data input txd 8 led anode leda figure 4. receiver logic circuit gp2w0110yps-3 tr 1 tr 2 260 k ? typical rxd figure 5. gp2w0110yps/GP2W0114YPS pin location gp2w0110yps-4 pin 1 pin 8 pin 8 pin 1
gp2w0110yps/GP2W0114YPS low po wer infrared transceiver 6 irda technical information electrical design application tips the only external component needed for the gp2w0110yps/GP2W0114YPS is a capacitor for fil- tering any power supply noise. application circ uit and external passive components the value of the external component cx in these examples is a nominal 10 f/6.3 v. however, it should be adjusted as necessary for power supply noise and frequency. v leda may be connected to v dd or driven sepa- rately from a different voltage source that is within the allowed range. the recommended operating voltage range for v dd is 2.0 v to 3.6 v, and the operating range for v leda is 2.0 v to 6.0 v. an example of split voltage source design is shown in figure 7. v dd provides power only to the receiver electronics. this regulated source can be at a lower potential than v leda (the voltage source for the led). the v leda voltage may be directly driven from the battery as shown in figure 7. the v dd associated with the receiver interface electronics may be supported by a power regulator or other device providing an efficient regulated lower volt age source. this voltage may be as low as 2.0 v to 3.6 v, and the v leda potential may range from 2.0 volts to 6.0 volts. an alternative is to connect the v leda and v dd pins together as shown in figure 8. this arrangement allows the gp2w0110yp s/GP2W0114YPS to be used in existing applications where both of these voltage sources are connected. it is footprint and interface compatible with previous sharp gp2w0102yp/ gp2w0104yp/gp2w0106yp products. figure 6. gp2w0110yps/GP2W0114YPS pin connections figure 7. split voltage source example figure 8. combining voltage sources 1 nc 2 nc 3 v dd 4 gnd gp2w0110yps-5 cx v dd gnd sd rxd txd 5 sd 6 rxd 7 txd 8 leda leda + component note: suitable cx value should be adjusted in accordance with the noise level and the power supply frequency. recommended values cx 10 f/6.3 v (note) receiver interface electronics rxd v leda v dd txd sd gp2w0110yps-6 receiver interface electronics rxd v leda v dd txd sd gp2w0110yps-7
low power infrared transc eiver gp2w0110yps/GP2W0114YPS irda technical information 7 shutdown mode the shutdown pin is an active high terminal, and performs the power save function according to table 3 and figure 9. signal waveform example figure 10 and figure 11 show the waveform at each point in the gp2w0110 yps/GP2W0114YPS block dia- gram as the device is being operated to irda stan- dards. the waveform example is only applicable as a design and evaluation reference to understand the gp2w0110yps/GP2W0114YPS hardware implemen- tation and system measurements. table 3. effect of shutdown pin input mode high shutdown low normal operation open normal operation figure 9. shutdown circuit operation figure 10. gp2w0110yps/GP2W0114YPS block diagram sd rxd operable shutdown enabled v ih v il high (or open) low 0.3 ms gp2w0110yps-8 gp2w0110yps-9 encoder circuit decoder circuit 3 1 2 4 5 figure 11. gp2w0110yps/GP2W0114YPS signal and irda waveforms notes: 1 transmitting data waveform 2 encoder circuit output waveform 3 transmitter output optical signal waveform 4 gp2w0110yps/GP2W0114YPS receiver output waveform 5 receiving data waveform 1 data rate t = data rate: 2.4 kbit/s, 9.6 kbit/s, 19.2 kbit/s, 38.4 kbit/s, 57.6 kbit/s, 115.2 kbit/s 0 0 t 3t/16 10 1 t 3 1 2 4 5 10 1 gp2w0110yps-10
gp2w0110yps/GP2W0114YPS low po wer infrared transceiver 8 irda technical information soldering reflow profile figure 12 shows a straight-line representation of the recommended temperature profile for the ir solder reflow process. the temperature profile is divided into four process sections with three temperature/time change rates. the temperature/time details are described in table 4. in process 1, the pcb and smd gp2w0110yps/ GP2W0114YPS molded pin join ts are heated to a tem- perature of 165 c to activate the flux in the solder paste. the temperature ramp up rate r 1 should be within the range of 1 c to 4 c per second. package temperature must be kept within the temperature range specified in order to avoid localized temperature rise in the resin by the infrared lamp. in process 2, sufficient time to dry the solder paste should be provided, a maximum of 120 seconds is rec- ommended for optimum results. the temperature should be kept stable with little temperature increase, preferably staying at the level of 165 c. process 3 is solder reflow. in this process, the tem- perature should be raised to 230 c for 5 seconds, at the rate of 1 c to 4 c per second (rate r2) for desired result. the dwell time above 200 c must not exceed 60 seconds. beyond 60 seconds, weak and unreliable connections will result. the temperature should be then reduced at the rate of -1 c to -4 c per second (rate r3). please note that deformation of the pcb can also affect the lead pins of the package, which may break the gold wire used in the transceiver module. full verification of the soldering reflow machine is highly recommended for optimum results. table 4. solder reflow parameters section temperature symbol temperature/time (max.) heat up to 165 c r1 1 c to 4 c/sec solder paste dry 165 c solder reflow 165 c to 230 c r2 1 c to 4 c/sec cooling 200 c ~ r3 -1 c to -4 c/sec.
low power infrared transc eiver gp2w0110yps/GP2W0114YPS irda technical information 9 figure 12. solder reflow process temperatures 200 c 230 c max. 165 c max. 25 c 50 c 100 c 150 c 120 sec. max. note: 1. heat up 2. solder paste dry 3. solder reflow 4. cooling 90 sec. max. 5 sec. max. 60 sec. max. (above 200 c) r3 r1 temperature c processes r2 gp2w0110yps-11 1 2 3 4
gp2w0110yps/GP2W0114YPS low po wer infrared transceiver 10 irda technical information mechanical design tips figure 13. recommended footprint figure 14. recommended solder paste screen dimensions 1 2 3 4 5 6 7 8 center of mounting area 1.55 0.6 0.475 1.425 2.375 3.325 1.0 1.1 2.0 0.1 1.55 notes: 1. dimensions are in mm. 2. dimensions are shown for reference. 3. connect foot pattern of shield case to gnd pattern. gp2w0110yps-17 1 2 3 4 5 6 7 8 nc nc v dd ground shutdown receiver data output transmitter data input led anode nc pin pin name symbol nc v dd gnd sd rxd txd leda 1.425 1.55 0.475 2.375 3.325 1.55 0.1 1.1 2.0 notes: 1. dimensions are in mm. 2. dimensions are for reference. 3. soldering paste area gp2w0110yps-18 0.6
low power infrared transc eiver gp2w0110yps/GP2W0114YPS irda technical information 11 designing an ir cosmetic window figure 15 and its calculations show an example and design tip for a cabinet and ir cosmetic window with + 18 viewing angles, in both vertical and horizontal axes. all values for the transceiver dimensions are only for design reference, and are given in mm. the irda specifications require a + 15 viewing angle at the trans- ceiver. the + 18 angle shown provides a little extra clearance to allow for slight manufacturing variations, so that the required angle is always met. the optical window size should be the minimum size of w h rectangular or ellip tical in order to maintain irda data transfer performance. the dimensions for width can be calculated by the formula of: w = 2 l tan18 + w and the dimensions for height can be calculated by the formula of: h = 2 l tan18 + h in the case of having a view angle of 18 , which conforms to or exceeds the irda serial infrared physi- cal layer link specifications. any values to be calcu- lated with above formula are given in mm. the dimension 7.9 mm as used in figure 15 and its calculations, is the physical length of the transceiver. this distance also includes the side angles of the optical lenses to simplify the overall calculation. the height of the transceiver is 2.15 mm with the shield; however, the actual transceiver face in the optical resin is 2.0 mm. these dimensions are listed in the mechanical drawings. figure 15. optical window aperture w (7.9) 18 18 18 18 l w note: dimensions are in mm. gp2w0110yps-12 h (2.0) h l
gp2w0110yps/GP2W0114YPS low po wer infrared transceiver 12 irda technical information product packaging many products that use infrared communication locate their reception component behind dark plastic. this often fits in with the overall design and coloring of the product, and has an intentional design purpose as well. the photodiode that is used in optical receivers is sensitive to a variety of light wavelengths, not only the wavelength intended for reception. visible light has many component factors and sources in a room. the dark plastic used in product faceplates can be formu- lated to act as a highpass filter, reducing the amount of visible light and other wavelengths landing on the pho- todiode and raising the internal noise currents. the reduction of unwanted wavelengths provides for a quieter and more sensitive receiver. the wavelength used for irda data communications is 880 nm. the char- acteristic of any plastic used in a final product should keep this in mind and not attenuate this wavelength. constructing an opti cal highpass filter a simple material for test purposes is to obtain a roll of 100 asa color film. pull the film all of the way out of the can and expose it to outdoor light for about 5 sec- onds. have the film developed, but first inform the per- son operating the developer what you are doing so that your intent is understood, and the material is processed correctly. otherwise you may be informed that the roll has been overexposed and the material was therefore discarded as unusable. the resulting developed nega- tive stock should be dark and difficult to see through. using one or more layers will provide a variable attenu- ation filter that you can tailor for experimental purposes. other light sources may produce different results. the graph in figure 16 was produced by exposing the film to a ?cool white? fluore scent lamp for five seconds. the filter transmission data is excerpted from an article in electronic design , december 2, 1996, written by david a. johnson. the response of the material is fairly steep near 830 nm, and has reasonable pass charac- teristics above 880 nm. figure 16 shows the basic characteristic of the high- pass filter. the exact position of the slope and increas- ing response will depend on the material selected and the light used to expose it. the intent is to supress vis- ible light, and neighboring wavelengths, and pass the desired 880 nm. other glass and plastic filters are available, and many vendors carry plastic materials that may be cut, bent or molded. the key to selecting a plastics vendor is to ask them about the wavelength characteristics of their materials. the more they know, the more likely they will be to help you in a knowledgeable manner when working on both the industrial design and wave- length pass characterist ics of your ir window. figure 16. optical highpass filter gp2w0110yps-13 100 90 80 70 60 response % transmission ultraviolet violet blue-green green yellow orange red 50 40 30 20 10 0 300 wavelength in nm 400 500 600 700 800 900 1,000 1,100
low power infrared transc eiver gp2w0110yps/GP2W0114YPS irda technical information 13 test and evaluation board sharp microelectronics has prepared an evaluation board for preliminary testing of the gp2w0110yps/ GP2W0114YPS transceiver. this board has also been developed to suppor t the gp2w0112yps, and that is why there are two resistor positions on the board. in the configuration for gp2w0110yps/ GP2W0114YPS, r 2 = 0 ? , and the r 1 position is open. (the position for r 1 is loaded when the board is used for another device model.) the new low power 20 cm transceivers are so small that soldering directly to the contacts on the device is not an easy or effective connection method. testing with an actual surface mount connection is the best method for evaluation. the pcb provides the electrical interface and a good ground-plane for test purposes. connector j1 is the interface to the test system. the device emi shield should be connected to a good ground in your final system. the value of capacitor cx 1 is listed as 10 f. this value should be modified to meet your system electrical noise requirements. the decision should be based on the amount of system noise at the point where the irda transceiver will be powered. both time-domain and fre- quency-domain noise issues should be considered. one common source of noise is switching power sup- plies, which need attention to both the power line and ground return paths. as shown in figure 17, capacitor cx 1 is the only external component needed with the transceiver. if the power supply filtering in your system design is such that no capacitor is needed, there is no absolute requirement for it and that is a decision left to the design engineer. note that the v dd connection and v leda connec- tions are on separate pins. if v dd and v leda are to be powered from the same source, pins 2 and 10 need to be externally connected. evaluation boards may be requested through any sharp microelectronics of the americas sales office. figure 17. evaluation board schematic gp2w0110yps-14 + + + + + + + + + + 1 2 3 4 5 6 7 8 nc nc v dd gnd sd rxd txd leda 1 3 5 7 9 2 v cc 4 txd 6 rxd 8 10 r 1 option r 2 0 ? gp2w0110yp j1 gnd sd gnd 2 5 cx1 10 f 6.3 v +
gp2w0110yps/GP2W0114YPS low po wer infrared transceiver ?2002 by sharp corporation reference code sma02011 specifications are subject to change without notice. suggested applications (if any) are for standard use; see important restrictions for limitations on special applications. see l imited warranty for sharp?s product warranty. the limited warranty is in lieu, and exclusive of, all other warranties, express or impl ied. all express and implied warranties, including the warranties of merchantability, fitness for use and fitness for a particular purpose, are specifically excluded. in no event will sharp be liable, or in any way responsible, for any incidental or consequential economic or property damage. north america europe japan sharp microelectronics of the americas 5700 nw pacific rim blvd. camas, wa 98607, u.s.a. phone: (1) 360-834-2500 fax: (1) 360-834-8903 fast info: (1) 800-833-9437 www.sharpsma.com sharp microelectronics europe division of sharp electronics (europe) gmbh sonninstrasse 3 20097 hamburg, germany phone: (49) 40-2376-2286 fax: (49) 40-2376-2232 www.sharpsme.com sharp corporation electronic components & devices 22-22 nagaike-cho, abeno-ku osaka 545-8522, japan phone: (81) 6-6621-1221 fax: (81) 6117-725300/6117-725301 www.sharp-world.com taiwan singapore korea sharp electronic components (taiwan) corporation 8f-a, no. 16, sec. 4, nanking e. rd. taipei, taiwan, republic of china phone: (886) 2-2577-7341 fax: (886) 2-2577-7326/2-2577-7328 sharp electronics (singapore) pte., ltd. 438a, alexandra road, #05-01/02 alexandra technopark, singapore 119967 phone: (65) 271-3566 fax: (65) 271-3855 sharp electronic components (korea) corporation rm 501 geosung b/d, 541 dohwa-dong, mapo-ku seoul 121-701, korea phone: (82) 2-711-5813 ~ 8 fax: (82) 2-711-5819 china hong kong sharp microelectronics of china (shanghai) co., ltd. 28 xin jin qiao road king tower 16f pudong shanghai, 201206 p.r. china phone: (86) 21-5854-7710/21-5834-6056 fax: (86) 21-5854-4340/21-5834-6057 head office: no. 360, bashen road, xin development bldg. 22 waigaoqiao free trade zone shanghai 200131 p.r. china email: smc@china.global.sharp.co.jp sharp-roxy (hong kong) ltd. 3rd business division, 17/f, admiralty centre, tower 1 18 harcourt road, hong kong phone: (852) 28229311 fax: (852) 28660779 www.sharp.com.hk shenzhen representative office: room 13b1, tower c, electronics science & technology building shen nan zhong road shenzhen, p.r. china phone: (86) 755-3273731 fax: (86) 755-3273735

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